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Hallux Valgus Correction Surgery Recovery Using Semiconductor Embedded Therapeutic Sleeves

Clinical Outcomes Related to Hallux Valgus Correction Surgery Recovery Using Semiconductor Embedded Therapeutic Sleeves: A Randomized, Double-Blind, Placebo-Controlled Clinical Investigation

Status
Suspended
Phases
Unknown
Study type
Interventional
Source
ClinicalTrials.gov
Registry ID
NCT07422623
Enrollment
115
Registered
2026-02-20
Start date
2026-03-01
Completion date
2027-01-01
Last updated
2026-08-21

For informational purposes only — not medical advice. Sourced from public registries and may not reflect the latest updates. Terms

Conditions

Hallux Valgus Deformity

Brief summary

This study is looking to test a non-compressive semiconductor embedded ankle sleeve and sock for post hallux valgus correction surgery rehabilitation. Hallux valgus (HV), commonly known as a bunion, is one of the most prevalent forefoot deformities. It affects approximately 23% of adults aged 18 to 65 and 36% of those over 65. Given the high incidence of HV, various surgical correction methods have been developed, with first tarsometatarsal (TMT) arthrodesis (Lapiplasty Arthrodesis) and first metatarsophalangeal (MTP) arthrodesis demonstrating the highest success rates in restoring function and preventing recurrence. Post-surgical symptoms typically include pain, swelling, and tenderness, but with proper rehabilitation and preventive measures, patients generally return to activity within weeks to months.The semiconductor embedded fabric increases blood circulation through activation of the embedded elements with body heat while worn and releases far infrared waves as well as negative ions. This energy has an effect inside the body that increases oxygen and nutrient flow to tissues, and can help to decrease pain and inflammation. This study is testing this technology to see if it can be used as a non-pharmacological treatment for rehabilitation post hallux valgus correction surgery.

Interventions

DEVICESemiconductor embedded ankle sleeve and sock

The active device contains semiconductors embedded in the ankle sleeve and sock

DEVICEPlacebo ankle sleeve and sock

Identical ankle sleeve and sock absent of semiconductors

Sponsors

INCREDIWEAR HOLDINGS, INC.
Lead SponsorINDUSTRY
foot and ankle center, Iowa
CollaboratorUNKNOWN

Study design

Allocation
RANDOMIZED
Intervention model
PARALLEL
Primary purpose
TREATMENT
Masking
DOUBLE (Subject, Investigator)

Eligibility

Sex/Gender
ALL
Age
18 Years to 75 Years
Healthy volunteers
No

Inclusion criteria

* Patients undergoing hallux valgus correction surgery including Lapiplasty Arthrodesis, MTP fusion, and TMT+MTP arthrodesis (double first ray arthrodesis). * Patients aged 18-75 * Patients who are willing and able to adhere to follow-up schedule and protocol guidelines. * Patients who are willing and able to sign corresponding research subject consent form.

Exclusion criteria

* Patient has a history of neurological conditions, including multiple sclerosis or Parkinson's disease * Patient has severe medical condition, including recent myocardial infarction, unstable angina, heart failure, severe anemia * Patient has had prior surgical treatment of the foot within the last 5 years * Patient has external hardware (wires) protruding from the foot post-surgery * Patient has had prior injections (PRP or Stem Cell) in the foot within the last 1 year * Patient has rheumatoid arthritis * Patient has chronic pain conditions unrelated to foot condition * Patient has auto-immune or auto-inflammatory diseases * Patient has used tobacco within the last 90 days * Patient has poorly controlled diabetes as determined by A1C levels \> 7.0 * Patient has an active infection (local or systemic) * Patient is unwilling or unable to sign the corresponding research subject consent form * Patient meets any other criteria or has any other condition that, in the opinion of the investigator, would prevent them from completing the study or that, in the opinion of the investigator, would confound study results.

Design outcomes

Primary

MeasureTime frameDescription
Change in participant Foot and Ankle Outcome Score (FAOS)3 monthsChanges in participant function and pain as determined by the Foot and Ankle Outcome score (FAOS) FAOS: Lowest score: 0 (extreme symptoms/limiations) Highest score: 100 (no symptoms or limitations)

Secondary

MeasureTime frameDescription
Change in participant Foot Function Index (FFI)3 monthsChanges in participant foot function and pain as determined by the Foot Function Index (FFI) as compared to the placebo group, FFI: Lowest score: 0 (no pain or disability) Highest Score: 100 (extreme pain and disability)
Changes in participant American Orthopedic Foot and Ankle Society-Hallux Valgus Score (AOFAS)3 monthsChanges in participant hallux valgus function and pain as determined by the American Orthopedic Foot and Ankle Society-Hallux Valgus Score (AOFAS) compared to placebo group. AOFAS-Hallux MTP-IP Score: Lowest Score: 0 ( severe pain and disability) Highest Score: 100 ( no pain or disability)
Participant-reported changes in pain3 monthsReduction in post hallux vagus correction surgery pain as determined by the Visual Analog Scale (VAS) compared to placebo group. Visual Analog Scale for Pain (VAS): Minimum Value: 0 (no pain) Maximum Value: 10 (worst possible pain)
Changes in oral medication intake compared to placebo group3 monthsAs measured by collecting concomitant medication information at baseline and changes throughout participation in the study.
Changes in swelling of the foot compared to placebo group3 monthsChanges in swelling of the anterior foot width, anterior foot circumference, hallux valgus width, hallux valgus circumference, and 4 cm above and below the patella circumference measurements will be taken in cm.
Changes in participant soft tissue thickness compared to placebo group3 monthsChanges in participant soft tissue thickness as determined by radiographic assessments (x-ray) of the width of the hallux values in cm.

Countries

United States

Outcome results

None listed

Source: ClinicalTrials.gov · Data processed: Aug 22, 2026