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Prevention of Post-colon ESD Coagulation Syndrome using Polysaccharide Hemostatic Powder

Prevention of Post-colon Endoscopic Submucosal Dissection Coagulation Syndrome using Polysaccharide Hemostatic Powder: a Randomized Controlled Trial

Status
Active, not recruiting
Phases
Unknown
Study type
Interventional
Source
CRIS
Registry ID
KCT0008728
Enrollment
196
Registered
2023-08-22
Start date
2023-10-25
Completion date
Unknown
Last updated
2023-09-18

For informational purposes only — not medical advice. Sourced from public registries and may not reflect the latest updates. Terms

Conditions

None listed

Interventions

Medical Device : For the colon lesions, after performing endoscopic submucosal dissection, the intervention group applied NexPowder, a polysaccharide powder hemostatic agent, to the artificial ulcer,

Sponsors

Soon Chun Hyang University Hospital Cheonan
Lead Sponsor

Eligibility

Sex/Gender
All

Inclusion criteria

Inclusion criteria: The study targeted patients who visited to undergo endoscopic submucosal dissection of the colon for lesions larger than 20mm in size.

Exclusion criteria

Exclusion criteria: ? The size of the lesion is less than 2cm ? The lesion is a pedunculated polyp ?The lesion is removed by a different method than endoscopic submucosal dissection (ESD) (such as endoscopic mucosal resection) ? Perforation occurs during ESD or ESD is not completed ? The artificial ulcer created after ESD is completely closed with endoscopic clips ? The operator’s experience of ESD is less than 50 cases ? The patient does not agree to participate in the study

Design outcomes

Primary

MeasureTime frame
Occurrence of electrocoagulation syndrome after colonic submucosal dissection

Secondary

MeasureTime frame
Risk factors for electrocoagulation syndrome after colonic submucosal dissection

Countries

Korea, Republic of

Contacts

Public ContactYunho Jung

Soon Chun Hyang University Hospital Cheonan

yunho7575@gmail.com+82-41-570-3742

Outcome results

None listed

Source: CRIS (via WHO ICTRP) · Data processed: Feb 4, 2026