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Examination of suturing of the wound using endoscopic clips which was made by endoscopic submucosal dissection (ESD) for the colorectal tumor to prevent the complications and accerarate the repair of the dissected area.

Examination of suturing of the wound using endoscopic clips which was made by endoscopic submucosal dissection (ESD) for the colorectal tumor to prevent the complications and accerarate the repair of the dissected area. - Efficacy of suturing of the wound using endoscopic clips which was made by ESD for colorectal tumor.

Status
Recruiting
Phases
Unknown
Study type
Interventional
Source
JPRN
Registry ID
JPRN-UMIN000009112
Enrollment
100
Registered
2012-10-15
Start date
2010-08-01
Completion date
Unknown
Last updated
2026-06-29

For informational purposes only — not medical advice. Sourced from public registries and may not reflect the latest updates. Terms

Conditions

More than 20mm colorectal tumors which can be resected using endoscopy.

Interventions

endoscopic clips no endoscopic clips

Sponsors

Juntendo University
Lead Sponsor

Eligibility

Sex/Gender
All

Inclusion criteria

Inclusion criteria: A patient who is diagnosed colorectal tumor more than 20mm.

Exclusion criteria

Exclusion criteria: 1. A patient who can not be gained agreement with our informed consent. 2. A patient who is determined as ineligible for a subject in this study by a doctor in charge or others. 3. A patient who can not be resected endoscopic treatment. 4. A patient who is suffered major complications under the endoscopic treatment.

Design outcomes

Primary

MeasureTime frame
Check for complications and repair rate of dissecterd area after ESD.

Secondary

MeasureTime frame
Residual rate of the endoscopic clips for sutured the wound after ESD. Correlation between the size of wound area after ESD and period of complete repair.

Countries

Japan

Contacts

Public ContactTaro Osada

Juntendo University Gastroenterology

otaro@juntendo.ac.jp03-3813-3111

Outcome results

None listed

Source: JPRN (via WHO ICTRP) · Data processed: Jul 3, 2026